As part of the Eleanore Hale Wilson Lecture Series*, ECE is proud to present:

Michael Mack, Product Manager

Cisco

Zoom Link: https://umn.zoom.us/j/92842770045

Abstract: 

We present novel packaging strategies developed specifically for high‐volume manufacturing of advanced, silicon‐photonics (SiP) transceivers and discuss the roadmap for future development. The approach is driven by the key challenges of: (1) integration of advanced electronic functions with SiP circuits, (2) integration of lasers with SiP circuits and (3) methods for interfacing multi-fiber connectors to SiP dies.

Silicon infamously lacks a way to generate the optical carrier signal monolithically. Accordingly we present a mature, multi‐generational silicon Laser Micro‐Package (LaMP) platform that employs wafer scale packaging methods to produce a low‐cost, high‐efficiency, chip‐scale, hermetic laser‐package in a ready for consumption, automation‐friendly format. We also discuss a suite of tools and technologies that were created to support the wafer scale MEMS manufacture and test process, including highly‐capable wafer scale burn‐in and test processes. The wafer‐scale assembly approach was further exploited with the modification of commercially available die bonders to allow the rapid active alignment and bonding of KG‐LaMP package to KG‐silicon photonic dies at full 300mm wafer scale. We present a method for aligning various fiber formats at PCBA panel scale without the need to activate the module under assembly.

Host: Professor Bethanie Stadler

*Established in 2009, the Eleanore Hale Wilson Fund supports engineering field leaders for travel to Minnesota to share their expertise and discoveries with University of Minnesota graduate students, faculty, and alumni. The fund also supports the receptions held in honor of each speaker.