Rhonda Franklin


Research Area: Biomedical and Biological Computational Methods, Devices, and System; Fields, Photonics, Magnetic Recording Technology; Micro and Nanostructures

6-127 Keller Hall

Area of Expertise:

Passives, interconnects, and integrated packages for RF, microwave, and millimeter wave applications


Ph.D., EE, 1995, University of Michigan, Ann Arbor, MI, United States
M.S., EE, 1990, University of Michigan, Ann Arbor, MI, United States
B.S., EE, 1988, Texas A&M University, College Station, TX, United States


My research interests focus on exploring the use of Microelectronic Mechanical Structures (MEMS) in radio frequency (RF) and microwave applications related to wireless, mobile, and satellite communications systems. In particular, emphasis is directed toward novel design, fabrication, and testing methods of planar circuits and antennas, such as microstrip, as well as package technology for integrated circuits. I am also interested in exploring the use of advanced micromachined packages and interconnects in photonic and high-speed electronic (also referred to as RF/microwave photonic) applications.

My educational interests focus on offering a diverse learning experience to future RF and microwave engineers through traditional classroom training, practical CAD, hands-on laboratory experiences and research opportunities. Web-based learning methods and multidisciplinary approaches are also explored that offer broader training and understanding of how applied electromagnetics fundamentals relate to applications in the communications field.


Drayton, R. F., R. M. Henderson, and L. P. B. Katehi. “Monolithic packaging concepts for High Isolation in Circuits and Antennas”. IEEE Transactions on Microwave Theory and Techniques, 46.7 (1998): 900-906.

Papapolymerou, I., R. F. Drayton, and L. P. B. Katehi. “Micromachined Patch Antenna”. IEEE Transactions on Antennas and Propagation, 46.2 (1998): 275-283.

Drayton, R. F., R. M. Henderson, and L. P. B. Katehi. “High Frequency Circuit Components on Micromachined Variable Thickness Substrates”. IEE Electronics Letters, 33.4 (1997): 303-304.